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专利名称：Method for wafer level stack die placement发明人：Hui-Lung Chou申请号：US11263974申请日：20051102
公开号：US20060099735A1公开日：20060511
专利附图：
摘要：A method for wafer level stack die placement is disclosed. At first, a waferincluding a plurality of dice is provided. The wafer is adhered to a photosensitive adhesivetape. The wafer is attached on a die carrier to fix at least one die from the wafer on thedie carrier. The die carrier may be another wafer. The photosensitive adhesive tape is
selectively exposed to form an adhesion-released portion. The adhesion-releasedportion is aligned with the fixed die. Then, the photosensitive adhesive tape and the diecarrier with the fixed die are apart. Therefore the stack die placement in the die-attachingbatch is quick and efficient.
申请人：Hui-Lung Chou
地址：Kaoshiung TW
国籍：TW
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