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专利名称：Wafer level dicing method发明人：Ying-Ju Chen,Hsien-Wei Chen申请号：US14011580申请日：20130827公开号：US10008413B2公开日：20180626
专利附图：
摘要：Disclosed herein is a method for dicing a wafer, the method comprising forminga molding compound layer over each of one or more dies disposed on a wafer, the one ormore dies separated by scribe lines, the molding compound layer having gaps over therespective scribe lines. The wafer is separated into individual dies along the gaps of the
molding compound in the scribe lines. Separating the wafer into individual dies comprisescutting at least a portion of the substrate with a laser. Forming the molding compoundlayer comprises applying a stencil over the one or more dies and using the stencil toform the molding compound layer.
申请人：Taiwan Semiconductor Manufacturing Company, Ltd.
地址：Hsin-Chu TW
国籍：TW
代理机构：Slater Matsil, LLP
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