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专利名称：SUBSTRATE, MANUFACTURING METHOD OF
SUBSTRATE AND SAW DEVICE
发明人：Yutaka TSUJI,Shigeru Nakayama申请号：US13275710申请日：20111018
公开号：US20120091856A1公开日：20120419
专利附图：
摘要：A substrate having appropriate strength and allowing firm bonding to apiezoelectric substrate and the like can be obtained at a lower cost. The substrate for anSAW device is formed of spinel, and PV value representing difference in level of one main
surface of the substrate is at least 2 nm and at most 8 nm. Preferably, average roughnessRa of one main surface of the substrate is at least 0.01 nm and at most 0.5 nm. With suchcharacteristics, the main surface of the substrate to be bonded to a piezoelectricsubstrate of the SAW device can be bonded satisfactorily to the piezoelectric materialforming the piezoelectric substrate utilizing van der Waals interaction.
申请人：Yutaka TSUJI,Shigeru Nakayama
地址：Osaka JP,Osaka JP
国籍：JP,JP
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