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专利名称：Microstructure device comprising a face to
face electromagnetic near field couplingbetween stacked device portions andmethod of forming the device
发明人：Crocifisso Marco Antonio Renna,Antonino
Scuderi,Carlo Magro,Nunzio Spina,EgidioRagonese,Barbaro Marano,GiuseppePalmisano
申请号：US13438684申请日：20120403公开号：US09018730B2公开日：20150428
专利附图：
摘要：A galvanic-isolated coupling of circuit portions is accomplished on the basis of astacked chip configuration. The semiconductor chips thus can be fabricated on the basisof any appropriate process technology, thereby incorporating one or more couplingelements, such as primary or secondary coils of a micro transformer, wherein the finalcharacteristics of the micro transformer are adjusted during the wafer bond process.
申请人：Crocifisso Marco Antonio Renna,Antonino Scuderi,Carlo Magro,NunzioSpina,Egidio Ragonese,Barbaro Marano,Giuseppe Palmisano
地址：Gela IT,Misterbianco IT,San Giovanni la Punta IT,Catania IT,Aci Catena IT,AcirealeIT,S. Giovanni la Punta IT
国籍：IT,IT,IT,IT,IT,IT,IT
代理机构：Seed IP Law Group PLLC
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