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专利名称：ELECTRONIC DEVICE HOUSING发明人：Toshikazu Satone,Mikio Iijima,Hajime
Nakajima,Takashi Okamuro,Yohichi Ohmura
申请号：US12295920申请日：20070329
公开号：US20100148044A1公开日：20100617
专利附图：
摘要：An electronic device housing includes a metallic base part ; a resin part fixed tothe base part ; and a printed circuit board coming into contact with the resin part ;wherein bonding of the base part to the resin part is carried out by way of a nanomold
technique and wherein the resin part has insulating property.
申请人：Toshikazu Satone,Mikio Iijima,Hajime Nakajima,Takashi Okamuro,YohichiOhmura
地址：Tokyo JP,Tokyo JP,Tokyo JP,Tokyo JP,Tokyo JP
国籍：JP,JP,JP,JP,JP
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