LM3528TMENOPB;LM3528TMXNOPB;LM3528TMEV;中文规格书,Datasheet资料

High Efficiency, Multi Display LED Driver with 128 ExponentialDimming Steps and Integrated OLED Power Supply in a 1.2mm × 1.6mm

micro SMD Package

General Description

The LM3528 current mode boost converter offers two sepa-rate outputs. The first output (MAIN) is a constant current sinkfor driving series white LED’s. The second output (SUB/FB)is configurable as a constant current sink for series white LEDbias, or as a feedback pin to set a constant output voltage forpowering OLED panels.

As a dual output white LED bias supply, the LM3528 adap-tively regulates the supply voltage of the LED strings to max-imize efficiency and insure the current sinks remain inregulation. The maximum current per output is set via a singleexternal low power resistor. An I2C compatible interface al-lows for independent adjustment of the LED current in eitheroutput from 0 to max current in 128 exponential steps. Whenconfigured as a white LED + OLED bias supply the LM3528can independently and simultaneously drive a string of up to6 white LED’s and deliver a constant output voltage of up to21V for OLED panels.

Output over-voltage protection shuts down the device ifVOUT rises above 22V allowing for the use of small sized lowvoltage output capacitors. Other features include a dedicatedgeneral purpose I/O (GPIO) and a multi-function pin (HWEN/PGEN/GPIO) which can be configured as a 32 bit patterngenerator, a hardware enable input, or as a GPIO. When con-figured as a pattern generator, an arbitrary pattern is pro-grammed via the I2C compatible interface and output atHWEN/PGEN/GPIO for indicator LED flashing or for externallogic control. The LM3528 is offered in a tiny 12-bump microSMD package and operates over the -40°C to +85°C temper-ature range.

Features

●●●●●●●●●●●●●●●●

128 Exponential Dimming Steps

Programmable Auto-Dimming FunctionUp to 90% Efficient

Low Profile 12 Bump µ-SMD Package (1.2mm x 1.6mm x0.6mm)

Integrated OLED Display Power Supply and LED DriverProgrammable Pattern Generator Output for LEDIndicator Function

Drives up to 12 LED’s at 20mA

Drives up to 5 LED’s at 20mA and delivers 18V at 40mA1% Accurate Current Matching Between StringsInternal Soft-Start Limits Inrush CurrentTrue Shutdown Isolation for LED’s

Wide 2.5V to 5.5V Input Voltage Range22V Over-Voltage Protection

1.25MHz Fixed Frequency Operation

Dedicated Programmable General Purpose I/OActive Low Hardware Reset

Applications

●●●●

Dual Display LCD Backlighting for Portable ApplicationsLarge Format LCD BacklightingOLED Panel Power Supply

Display Backlighting with Indicator Light

Typical PCB Layout

30020563

Typical Application Circuit

30020501

PRODUCTION DATA information is current as of

publication date. Products conform to specifications perthe terms of the Texas Instruments standard warranty.Production processing does not necessarily includehttp://oneic.com/

testing of all parameters.

300205 SNVS513ACopyright © 1999-2012, Texas Instruments Incorporated

LM3528

Connection Diagram

Top View

12-Bump (1.215mm × 1.615mm × 0.6mm) 12AAA

30020502

Ordering Information

Order NumberLM3528TMELM3528TMX

Package Type12-Bump micro SMD

NSC Package Drawing

12AAA12AAA

Top Mark

SESE

Supplied As

250 units, Tape-and-Reel, No Lead3000 units, Tape-and-Reel, No Lead

Pin Descriptions/Functions

PinA1A2A3B1B2B3C1C2C3D1D2D3

NameOVPMAINSUB/FBGPIO1SCLSETHWEN/PGEN/

GPIO

SDAINVIOSWGND

Function

Over-Voltage Protection Sense Connection. Connect OVP to the positive terminal of the outputcapacitor.

Main Current Sink Input.

Secondary Current Sink Input or 1.21V Feedback Connection for Constant Voltage Output.Programmable General Purpose I/O.Serial Clock Input

LED Current Setting Connection. Connect a resistor from SET to GND to set the maximum LEDcurrent into MAIN or SUB/FB (when in LED mode), where ILED_MAX = 192×1.244V/RSET.Active High Hardware Enable Input. Programmable Pattern Generator Output, and ProgrammableGeneral Purpose I/O.Serial Data Input/Output

Input Voltage Connection. Connect IN to the input supply, and bypass to GND with a 1µF ceramiccapacitor.

Logic Voltage Level Input

Drain Connection for Internal NMOS SwitchGround

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LM3528

Absolute Maximum Ratings (Note 1, Note 2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors foravailability and specifications.

VIN

VSW, VOVP,VSUB/FB, VMAIN

VSCL, VSDA, VRESET\\GPIO, VIO ,VSET

Continuous Power DissipationJunction Temperature (TJ-MAX)Storage Temperature RangeMaximum Lead Temperature(Soldering, 10s)(Note 3)ESD Rating(Note 10)Human Body Model

−0.3V to 6V−0.3V to 25V−0.3V to 23V−0.3V to 6VInternally Limited

+150°C

-65°C to +150°C

+300°C2.5kV

Operating Ratings

(Note 1, Note 2)

VIN

VSW, VOVP,VSUB/FB, VMAIN

Junction Temperature Range(TJ)(Note 4)

Ambient Temperature Range(TA)(Note 5)

2.5V to 5.5V0V to 23V0V to 21V-40°C to +110°C-40°C to +85°C

Thermal Properties

Junction to Ambient ThermalResistance (θJA)(Note 6)

68°C/W

ESD Caution Notice

Texas Instruments recommends that all integrated circuits be handled with appropriate ESD precautions. Failure to observe properESD handling techniques can result in damage to the device.

Electrical Characteristics

Specifications in standard type face are for TA = 25°C and those in boldface type apply over the Operating Temperature Rangeof TA = −40°C to +85°C. Unless otherwise specified VIN = 3.6V, VIO = 1.8V, VRESET/GPIO = VIN, VSUB/FB = VMAIN = 0.5V, R =12.0kΩ, OLED = ‘0’, ENM = ENS = ‘1’, BSUB = BMAIN = Full Scale.(Note 2, Note 7)

SET

SymbolILED

Parameter

Output Current RegulationMAIN or SUB/FB EnabledMaximum Current PerCurrent Sink

Conditions

UNI = ‘0’, or ‘1’,2.5V < VIN < 5.5VRSET = 8.0kΩ

UNI = ‘1’,

2.5V < VIN < 5.5V (Note 11)3.0V < VIN < 5V

Min18.5 1.170

Typ20300.151.2441925001.213000.43

Max22 1 1.237

Units

mA%V mVVmVΩ

ILED-MATCHVSETILED/ISETVREG_CSVREG_OLEDVHRRDSON

IMAIN to ISUB/FB CurrentMatchingSET Pin Voltage

ILED Current to ISET Current Ratio

Regulated Current SinkHeadroom Voltage

VSUB/FB Regulation Voltage2.5V < VIN < 5.5V, OLED = ‘1’in OLED ModeCurrent Sink MinimumHeadroom VoltageNMOS Switch OnResistance

ILED = 95% of nominalISW = 100mA

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LM3528

SymbolICLVOVP

Parameter

Output Over-VoltageProtection

Conditions

ON Threshold,2.5V < VIN < 5.5VOFF Threshold,2.7V < VIN < 5.5V

Min520.619.251.0

Typ7702220.61.279010

Max90023

UnitsmA

NMOS Switch Current Limit2.5V < VIN < 5.5V

V

21.51.4

MHz%%

fSWDMAXDMINIQ

Switching FrequencyMaximum Duty CycleMinimum Duty CycleQuiescent Current, DeviceNot Switching

VMAIN and VSUB/FB >VREG_CS,

BSUB = BMAIN = 0x00, 2.5V< VIN < 5.5V

VSUB/FB > VREG_OLED,

OLED=’1’, ENM=ENS=’0’,RSET Open,

2.5V < VIN < 5.5V

350390

µA

250260

ISHDN

Shutdown Current

ENM = ENS = OLED = '0',2.5V < VIN < 5.5V

2.5V < VIN <5.5V, MODE bit= 0

2.5V < VIN < 5.5V, MODE bit= 0

ILOAD=3mA, MODE bit = 12.5V < VIN < 5.5V (Note 9)2.5V < VIN < 5.5V2.5V < VIN < 5.5VILOAD = 3mA

1.83µA

HWEN/PGEN/GPIO, GPIO1 Pin Voltage SpecificationsVILVIHVOLVIOVILVIHVOLt1t2t3

t4

Input Logic LowInput Logic HighOutput Logic LowSerial Bus Voltage LevelInput Logic LowInput Logic HighOutput Logic LowSCL Clock Period

1.1 1.7 0.7×VIO

2.51000100100

0.5 400VIN0.36×VIO

400

VVmVVVVmVµsnsnsnsns

I2C Compatible Voltage Specifications (SCL, SDA, VIO)

I2C Compatible Timing Specifications (SCL, SDA, VIO, see Figure 1) (Note 8, Note 9)

Data In Setup Time to SCL High

Data Out Stable After SCLLow

SDA Low Setup Time toSCL Low (Start)

SDA High Hold Time AfterSCL High (Stop)

t5

Note 1:Absolute maximum ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions for which the device is intendedto be functional, but device parameter specifications may not be guaranteed. For guaranteed specifications and test conditions, see the Electrical Characteristics.Note 2:All voltages are with respect to the potential at the GND pin.

Note 3:For detailed soldering specifications and information, please refer to Texas Instruments Application Note 1112: Micro SMD Wafer LEvel Chip ScalePackage (AN-1112).

Note 4:Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ=+150°C (typ.) and disengages atTJ=+140°C (typ.).

Note 5:In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to bederated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = +105°C), the maximum powerdissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the part/package in the application (θJA), as given by thefollowing equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX).

Note 6:Junction-to-ambient thermal resistance (θJA) is taken from a thermal modeling result, performed under the conditions and guidelines set forth in the JEDECstandard JESD51-7. The test board is a 4-layer FR-4 board measuring 114.3mm x 76.2mm x 1.6mm. The ground plane on the board is 113mm x 75mm. Thicknessof copper layers are 71.5µm/35µm/35µm/71.5µm (2oz/1oz/1oz/2oz). Ambient temperature in simulation is 22°C, still air. Power dissipation is 1W. For moreinformation on these topics, please refer to Texas Instruments Application Note 1112, and JEDEC Standard JESD51-7.

Note 7:Min and Max limits are guaranteed by design, test, or statistical analysis. Typical (Typ) numbers are not guaranteed, but represent the most likely norm.

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LM3528

Note 8:SCL and SDA must be glitch-free in order for proper brightness control to be realized.

Note 9:SCL and SDA signals are referenced to VIO and GND for minimum VIO voltage testing. VIO limits indicate the minimum voltage at VIO at which the partis operational.

Note 10:The human body model is a 100pF capacitor discharged through 1.5kΩ resistor into each pin. (MIL-STD-883 3015.7).

Note 11:The matching specification between MAIN and SUB is calculated as 100 × ((IMAIN or ISUB) - IAVE) / IAVE. This simplifies out to be100 × (IMAIN - ISUB)/(IMAIN + ISUB).

Timing Diagram

30020503

FIGURE 1. I2C Timing

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LM3528

Typical Performance Characteristics

VIN = 3.6V, LEDs are Nichia (NSSW008C), COUT = 1µF (LED

Mode), COUT = 2.2µF (OLED Mode), CIN = 1µF, L = TDK VLF4012AT-100MR79, (RL = 0.3Ω), RSET = 12.1kΩ, UNI = '1', ILED =ISUB + IMAIN, TA = +25°C unless otherwise specified.

2x6 LED Efficiency vs ILED

(2 Strings of 6LEDs)

2x5 LED Efficiency vs ILED

(2 Strings of 5LEDs)

3002050830020509

2x4 LED Efficiency vs ILED

(2 Strings of 4LEDs)2x3 LED Efficiency vs ILED

(2 Strings of 3LEDs)

3002051030020511

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LM3528

2x2 LED Efficiency vs ILED

(2 Strings of 2LEDs)

LED Efficiency vs VIN

(L = TDK VLF3012AT-100MR92, RL = 0.36Ω, ISUB + IMAIN =

40mA)

30020512

30020513

18V OLED Efficiency vs IOUT12V OLED Efficiency vs IOUT

3002051430020515

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LM3528

LED Line Regulation

(UNI = '0')

OLED Line Regulation

IOLED = 60mA

3002051630020517

OLED Line Regulation

IOLED = 60mAOLED Load Regulation

VOLED = 18V

3002051830020519

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LM3528

OLED Load Regulation

VOLED = 12V

Peak Current Limit vs. VIN

30020521

30020520

Over Voltage Limit vs. VINSwitch On-Resistance vs. VIN

3002052230020523

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LM3528

Switching Frequency vs. VINMaximum Duty Cycle vs. VIN

3002052430020525

Shutdown Current vs. VINSwitching Supply Current vs. VIN

3002052630020527

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