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专利名称：SUBSTRATE, STRUCTURE FOR MOUNTING
SURFACE MOUNTING COMPONENT, ANDELECTRONIC DEVICE
发明人：YUGAMI, KAZUYUKI,FURUSAWA, KOJI申请号：EP09735831申请日：20090424公开号：EP22788A4公开日：20110914
摘要：To solve a problem in which when a surface mounting component to besoldered at a vicinity of an end portion is mounted by soldering, warpage may occurs in aboard or the surface mounting component and a distance between the terminal of theboard and the terminal of the surface mounting component increases and whereby aconnection failure occurs with respect to a connection using the solder. For this purpose,in a mounting structure of the surface mounting component that is configured byconnecting the surface mounting component to the board at the vicinity of the endportion by soldering, a concave portion is formed between joint portions for thesoldering in a range in which the surface mounting component of the board is mounted.This concave portion is configured so that an influence of deformation due to thewarpage of the board or/and the surface mounting component can be reduced by theconcave portion.
申请人：NEC CORPORATION
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